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敦煌本《七階禮》殘卷綴合研究=On the Patching-up of the Fragments of Dunhuang Manuscripts Qijie Li (《七階禮》)
Author 張涌泉 (著)=Zhang, Yongquan (au.) ; 沈秋之 (著)=Shen Qiuzhi (au.)
Source 敦煌學輯刊=Journal of Dunhuang Studies
Volumev.2020 n.3
Date2020
Pages24 - 36
Publisher蘭州大學敦煌學研究所敦煌學輯刊編輯部
Publisher Url http://dhxyjs.lzu.edu.cn/
Location蘭州, 中國 [Lanzhou, China]
Content type期刊論文=Journal Article
Language中文=Chinese
Note張涌泉:浙江大學古籍研究所
沈秋之:浙江大學古籍研究所
Keyword敦煌文獻; 《七階禮》; 殘卷; 綴合
Abstract通過對已公布的敦煌文獻圖版的全面普查,我們已發現《七階禮》寫卷120號,其中絕大多數為殘卷或殘片。本文通過殘字、內容、行款格式、書風字跡、污跡殘損等不同角度的比較分析,將其中30號殘卷或殘片綴合為12組,以此更客觀地判斷寫卷的具體性質,有助于深入地考察敦煌禮懺文寫卷定名等問題。
Table of contents一、“七階佛名經” 型殘卷綴合 25
(一) BD10338+BD2844 25
(二) BD12024+BD673 26
(三) BD3019+BD2881 27
(四) BD7291+BD9262 28
(五) BD8039+BD7119 29
(六) P. 2415+P. 2869 30
(七) Дх5131+Дх5602...Дх10492 31
二、“七階禮懺文” 型殘卷綴合 32
(一) S. 1931+S. 10480 32
(二) Дх3408V+ ( Дх3813V+Дх3910V) +Дх3915V+Дх2602V...BD3068V 32
(三) Дх6090+ “Дх1048、Дх1233” 34
(四) Дх11789+Дх10482 34
(五) BD10790...BD8965 35
ISSN10016252 (P); 10016252 (E)
Hits281
Created date2021.06.17



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